Volframin sputterointitavoite

Volframi kohde, joka tunnetaan myös nimellä volframi sputtering kohde, on tuote, joka on valmistettu puhtaasta volframijauheesta raaka-aineena. Se on hopeanvärinen valkoinen ulkonäkö ja on suosittu monilla aloilla erinomaisten fysikaalisten ja kemiallisten ominaisuuksiensa vuoksi.

Volframin sputterointitavoite yksityiskohtaiset tiedot

Product Details

Material: W1

Type: flat target, rotating target

Shape: tubular, square, round, long strip

Purity: 99.95%, 99.97%

Conventional density: 19.0g/cm3~19.2g/cm3

High density: >19.2g/cm3

Size: processed according to the drawing to meet the precision requirements

Product features: high density, high purity, fine grains, good density

The main uses of tungsten targets include:

1. Preparation of electronic devices: Tungsten targets are widely used in the preparation of electronic devices, such as integrated circuits (ICs), flat panel displays (FPDs), solar cells, etc. During the preparation process, the tungsten target is placed in a target gun in a vacuum chamber, and tungsten atoms or ions are released through ion bombardment or electron beams, which are deposited on the surface of the substrate to form the required tungsten film.

2. Conductive materials: Tungsten targets are often used in the preparation of conductive materials due to their good conductivity and high melting point. They can be used to prepare high-temperature resistors, electrode materials, high-power electronic devices, etc.


3. Metal evaporation source: Tungsten target can be used as a metal evaporation source to carry out metal evaporation process in a vacuum. During the evaporation process, the tungsten target is heated to a high temperature to evaporate it into metal vapor, which is then deposited on the substrate to form a metal film.
Users of tungsten targets include semiconductor manufacturers, display manufacturers, photovoltaic industry, electronic device manufacturers, scientific research institutions, etc. These industries and units widely use tungsten targets in the fields of film preparation, material research, and electronic device production.

Process flow:

Flat target: tungsten powder-pressing-sintering-rolling-deep processing-surface treatment-finished product-testing-packaging

Small rotary target: tungsten powder-pressing-sintering-forging-deep processing-surface treatment-finished product-testing-packaging

Large rotary target: tungsten powder-pressing-sintering-deep processing-surface treatment-finished product-testing-packaging

Volframi sputterointi kohteita käytetään magnetroni sputterointi pinnoitteessa. Sputtering pinnoite on yksi tärkeimmistä fysikaalisen höyrylaskeuman menetelmistä (PVD). Sitä käytetään tallettamaan ohuita kalvoja, joilla on erityisiä toimintoja pinnalle. Sputtering kohteita käytetään pääasiassa litteän näytön pinnoituksessa, puolijohdepinnoituksessa