Molybdeeni-kupariseos
Molybdenum-copper alloys are a class of materials consisting of copper and molybdenum. These alloys are used in a variety of applications, such as electrical contacts, electrical connectors, and electrical components. They are also used in high-temperature applications, such as rocket nozzles and furnace components. Molybdenum-copper alloys typically have a higher electrical conductivity than pure molybdenum, and are also more resistant to corrosion and oxidation than pure copper. They are often used in applications where high electrical conductivity, corrosion resistance, and thermal stability are desired.
Molybdenum copper alloy has excellent thermal and conductive properties, and can be designed expansion coefficient, so it is commonly used as electrical contact materials, high-power electronic devices, heat dissipating devices, heat sink materials and packaging materials. Due to the immiscibility between molybdenum and copper, molybdenum-copper alloys are generally prepared by powder metallurgy. At present, with the development of high and new technology, the performance of molybdenum-copper materials is more and more demanding. These performance requirements are mainly manifested in: high densification (> 98%) and low gas content; Strict control of material composition and structure; Strictly control the size and deformation of structure products
Compared with tungsten-copper alloy, molybdenum-copper alloy has lighter weight and easier processing. Its expansion coefficient, thermal conductivity and some main mechanical properties are similar to those of tungsten-copper alloy. Although its heat resistance is not as good as tungsten copper alloy, it is better than some current heat resistant materials, so it has the prospect of application.
The mechanical properties of molybdenum-copper alloy are affected by its composition and residual porosity. Generally, its strength and hardness are between molybdenum and copper, decreasing with the increase of copper content, but toughness increases.
In the devices requiring high thermal conductivity, such as ultra-high frequency cermet tube, high power transistor and other requirements of good thermal conductivity sealing parts and as the lower electrode and substrate of high power silicon wafer, can reduce the thermal resistance, improve the working stability and life. If it can be made into sheets (less than 1.1cm in thickness), it is possible to use them for device frame leads because molybdenum-copper alloys have good heat resistance (they do not soften when heated) and meet the requirements for thermal conductivity.
Molybdenum-copper sheet, copper-molybdenum-copper composite sheet can be used as radiator. The thermal conductivity of 15% molybdenum-copper alloy can reach 160W/(m·K). The vertical thermal conductivity of Cu - Mo - Cu composite plate is 7% higher than that of pure Mo, and the horizontal thermal conductivity is greater.
In addition to the above advantages, molybdenum-copper alloy also has good heat resistance and high temperature strength. Although its gas ablative resistance and reentry heat resistance are not as good as tungsten copper alloy, it is still better than some existing materials, so it can replace these materials and obtain new applications.
Molybdenum-copper alloy is used as a heat sink material because of its high thermal conductivity. The properties of these two alloys are similar, and the density of molybdenum-copper alloy is less than that of tungsten-copper alloy. The preparation of molybdenum copper alloy is mainly by melting method, using high quality molybdenum powder and oxygen free copper powder, the application of isostatic pressing molding (high temperature sintering - copper infiltration), fine structure, good arc breaking performance, good electrical conductivity, good thermal conductivity, small thermal expansion.
Molybdenum-copper alloy
MoCu alloy
Composed of copper with high thermal conductivity and molybdenum with low thermal expansion coefficient, MoCu composites are ideal for manufacturing passive cooling components (radiators) in electronic components
MoCu molybdenum-copper alloy is a composite material composed of molybdenum and copper. MoCu is similar in performance to WCu, but has a lower density, making it more suitable for the spacecraft and aerospace industry.
Advantages of MoCu molybdenum copper alloy:
The coefficient of thermal expansion of MoCu can be adjusted
High thermal conductivity
Precision flatness
gilding
Zero fillet radius
Low coefficient of expansion
Good electrical conductivity
ultra-wear-resistant
Application of MoCu molybdenum-copper alloy
radiator
Microwave carrier
Microelectronic packaging substrates and enclosures
Ceramic carrier
Bases for gallium arsenide and silicon devices
The base of the laser diode
Table sticker encapsulated conductor
The cover of the microprocessor
